深圳市阳和通电子有限公司

3PEAK(思瑞浦), GigaDevice(兆易创新), Murata(村田), PANASONIC(松下), Renesas(瑞萨), ROHM(罗姆), SIMCom(芯讯通), TAIYO YUDEN(太诱), UTC(友顺)

CHIPSEA(芯海科技), Hiksemi(海康存储), HORIZON(地平线), KDS(大真空), LRC(乐山无线电), Nordic(北欧半导体), NOVOSENSE(纳芯微电子), ROHM(罗姆), SEMTECH(升特), SGMICRO(圣邦), STMicroelectronics(意法半导体), UNISOC(紫光展锐)

Aeonsemi(益昂), ALLEGRO(美国埃戈罗), Ambarella(安霸), AMLOGIC(晶晨), Ampleon, ams OSRAM(艾迈斯欧司朗), AnDAPT, Asmedia(祥碩), Avalanche Technology, DIODES(美台), Efinix, ESMT(晶豪), GigaDevice(兆易创新), Hoturnkey(好神奇), Intel(英特尔), LG, Lumileds(亮锐), MagnaChip(美格纳), Marvell(美满), MAXLINEAR(迈凌), MediaTek(联发科), Microchip(微芯), Micron Technology, MPS(芯源), Nanya(南亚科技), Navitas Semiconductor(纳微半导体), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PanJit(强茂), Qualcomm(高通), Renesas(瑞萨), Richtek(立锜), Silergy(矽力杰), Silicon Labs(芯科), Skyworks(思佳讯), STMicroelectronics(意法半导体), Synaptics(新思国际), u-blox, VISHAY(威世), Wolfspeed

Allwinner(全志), AltoBeam(高拓讯达), Amphenol(安费诺), BYD(比亚迪半导体), bynav(北云科技), CR MICRO(华润微), Everest-semi(顺芯), Flex(伟创力), GALAXYCORE(格科微), GigaDevice(兆易创新), GPT(泰科天润), HISILICON(海思), Innovision(长工微), JLSEMI(景略), Lanhai Photoelectricity(蓝海光电), LG, Littelfuse(美国力特), Longsys(江波龙), LRC(乐山无线电), Maxio(联芸科技), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), PANGOMICRO, PIP Semi(丽隽), Prisemi(芯导), pSemi, SMARTSENS(思特威), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), Techpoint, THine(赛恩电子), Tollsemi(拓尔微), Truly(信利), UNISOC(紫光展锐), vgsemi(威兆), Wolfspeed

3L COILS(台湾三礼), AisinoChip(航芯), Amphenol(安费诺), BM(丰明电容), BYD(比亚迪半导体), Chipown(芯朋微), Churod(中汇瑞德), COSEMITECH(意瑞), CR MICRO(华润微), Etasolution(钰泰), Fenghua(风华高科), Holy Stone(禾伸堂), Honeywell(霍尼韦尔), Hongfa(宏发), Hosonic(鸿星), Knowles(楼氏), LITEON(光宝), Longsys(江波龙), LRC(乐山无线电), MCC(美微科), Nation(国民技术), Nexperia(安世), Onmicro(昂瑞微), PanJit(强茂), QUNXIN(群芯微), Ralec(旺诠), ROHM(罗姆), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), TDK(东电化), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), VISHAY(威世)