深圳市阳和通电子有限公司

3PEAK(思瑞浦), ALLEGRO(美国埃戈罗), Bourns(伯恩斯), CIROCOMM(太盟光电), DIODES(美台), GigaDevice(兆易创新), Silergy(矽力杰)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

3PEAK(思瑞浦), ABB, AMD(超威), AMLOGIC(晶晨), ams OSRAM(艾迈斯欧司朗), Analog Devices(亚德诺), AWINIC(艾为), CXMT(长鑫存储), FM(复旦微), GigaDevice(兆易创新), LITEON(光宝), Longsys(江波龙), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Nexperia(安世), NVIDIA(英伟达), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), Qorvo(超群), Qualcomm(高通), Quectel(移远), Renesas(瑞萨), SEMTECH(升特), SGMICRO(圣邦), Silergy(矽力杰), UNISOC(紫光展锐), WeEn(瑞能), XHSC(小华半导体), XMC(武汉新芯)

3L COILS(台湾三礼), APM(永源), CHIPSEA(芯海科技), Churod(中汇瑞德), CONNTEK(昆泰芯), CR MICRO(华润微), Fenghua(风华高科), GPT(泰科天润), Hosonic(鸿星), INJOINIC(英集芯), JJW(捷捷微电), NCEPOWER(新洁能), NOVOSENSE(纳芯微电子), PanJit(强茂), Prisemi(芯导), RUNIC(润石), Senodia(深迪), Silan(士兰微), Silergy(矽力杰), Sunlord(顺络), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), Wayon(维安)