深圳淇诺科技有限公司

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

Allwinner(全志), AltoBeam(高拓讯达), Amphenol(安费诺), BYD(比亚迪半导体), bynav(北云科技), CR MICRO(华润微), Everest-semi(顺芯), Flex(伟创力), GALAXYCORE(格科微), GigaDevice(兆易创新), GPT(泰科天润), HISILICON(海思), Innovision(长工微), JLSEMI(景略), Lanhai Photoelectricity(蓝海光电), LG, Littelfuse(美国力特), Longsys(江波龙), LRC(乐山无线电), Maxio(联芸科技), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), PANGOMICRO, PIP Semi(丽隽), Prisemi(芯导), pSemi, SMARTSENS(思特威), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), Techpoint, THine(赛恩电子), Tollsemi(拓尔微), Truly(信利), UNISOC(紫光展锐), vgsemi(威兆), Wolfspeed

Allwinner(全志), AMD(超威), AMPAK(正基科技), ams OSRAM(艾迈斯欧司朗), AOS(万国半导体), FM(复旦微), GigaDevice(兆易创新), GPT(泰科天润), HISILICON(海思), Intel(英特尔), ISSI(矽成), KYOCERA AVX(京瓷), Littelfuse(美国力特), Longsys(江波龙), LOONGSON(龙芯), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Murata(村田), NVIDIA(英伟达), Oriental SEMI(东微半导体), PANASONIC(松下), Quectel(移远), QUNXIN(群芯微), Realtek(瑞昱), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), Sandisk(闪迪), SGMICRO(圣邦), Skyworks(思佳讯), Telit Cinterion, VISHAY(威世), YMTC(长江存储)

AMLOGIC(晶晨), AWINIC(艾为), BELLING(贝岭), CR MICRO(华润微), Egmicro(屹晶微), Etasolution(钰泰), FMD(辉芒微), GigaDevice(兆易创新), HISILICON(海思), ILITEK(奕力), Maxscend, MinebeaMitsumi, RUNIC(润石), Silan(士兰微), SMARTSENS(思特威)