益登科技股份有限公司

CHIPSEA(芯海科技), Hiksemi(海康存储), HORIZON(地平线), KDS(大真空), LRC(乐山无线电), Nordic(北欧半导体), NOVOSENSE(纳芯微电子), ROHM(罗姆), SEMTECH(升特), SGMICRO(圣邦), STMicroelectronics(意法半导体), UNISOC(紫光展锐)

3PEAK(思瑞浦), Ampleon, Barrot(百瑞), BELLING(贝岭), CR MICRO(华润微), CXMT(长鑫存储), GigaDevice(兆易创新), HISILICON(海思), KDS(大真空), KIOXIA(铠侠), Knowles(楼氏), Longsys(江波龙), Lumileds(亮锐), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), onsemi(安森美), Quectel(移远), Renergy(锐能微), ROHM(罗姆), SMARTSENS(思特威), Sony(索尼), STMicroelectronics(意法半导体), VISHAY(威世), WPM(维攀微), XMC(武汉新芯)

3L COILS(台湾三礼), AisinoChip(航芯), Amphenol(安费诺), BM(丰明电容), BYD(比亚迪半导体), Chipown(芯朋微), Churod(中汇瑞德), COSEMITECH(意瑞), CR MICRO(华润微), Etasolution(钰泰), Fenghua(风华高科), Holy Stone(禾伸堂), Honeywell(霍尼韦尔), Hongfa(宏发), Hosonic(鸿星), Knowles(楼氏), LITEON(光宝), Longsys(江波龙), LRC(乐山无线电), MCC(美微科), Nation(国民技术), Nexperia(安世), Onmicro(昂瑞微), PanJit(强茂), QUNXIN(群芯微), Ralec(旺诠), ROHM(罗姆), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), TDK(东电化), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), VISHAY(威世)

Advanced Analog Technology, AKM, Alif Semiconductor, AMPAK(正基科技), Ampere, Analogix(硅谷数模), AppoTech(卓荣), ArkX, AsteraLabs, Axelite(亚瑟莱特), Baraja, C-media, Canyon(耕源), Cimetrix, Cyberlink, Eggtronic, EGIS, FocalTech, FRAMOS, FURUNO(古野), GigaDevice(兆易创新), GoMore, Hannstar(瀚宇彩晶), INJOINIC(英集芯), Innolux(群创光电), ITE(联阳), Kinetic(芯凯), Kingston(金士顿), Leahkinn(力勤), LG, Longsys(江波龙), Marvell(美满), Maxscend, Micron Technology, MinebeaMitsumi, MPS(芯源), NVIDIA(英伟达), Pixelworks, Qorvo(超群), Renesas(瑞萨), RICOM(福光), ROHM(罗姆), Sandisk(闪迪), Silanna, Silicon Labs(芯科), Sinopower(大中), Skyworks(思佳讯), Solomon(晶门), Sonion, Sony(索尼), STMicroelectronics(意法半导体), Superior Sensor Technology, Supermicro(超微), Synaptics(新思国际), TagoreTech, TAIYO YUDEN(太诱), Taoglas, TDK(东电化), Telit Cinterion, Terminus(汤铭), THALES(泰雷兹), TOREX, Union(英联), USI(环旭), Western Digital(西部数据), Zowie(智威科技)