艾睿电子（Arrow Electronics）

AMPAK(正基科技), ARM, Bourns(伯恩斯), BROADCOM(博通), DIODES(美台), Epson(爱普生), ESMT(晶豪), Etron(钰创), Littelfuse(美国力特), MCC(美微科), MXIC(旺宏), Navitas Semiconductor(纳微半导体), Renesas(瑞萨), SEMTECH(升特), vgsemi(威兆)

3PEAK(思瑞浦), ABB, AMD(超威), AMLOGIC(晶晨), ams OSRAM(艾迈斯欧司朗), Analog Devices(亚德诺), AWINIC(艾为), CXMT(长鑫存储), FM(复旦微), GigaDevice(兆易创新), LITEON(光宝), Longsys(江波龙), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Nexperia(安世), NVIDIA(英伟达), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), Qorvo(超群), Qualcomm(高通), Quectel(移远), Renesas(瑞萨), SEMTECH(升特), SGMICRO(圣邦), Silergy(矽力杰), UNISOC(紫光展锐), WeEn(瑞能), XHSC(小华半导体), XMC(武汉新芯)

3PEAK(思瑞浦), ABB, Advantech(研华), ALLEGRO(美国埃戈罗), AMD(超威), Ampleon, ams OSRAM(艾迈斯欧司朗), Analog Devices(亚德诺), Bourns(伯恩斯), CHIPSEA(芯海科技), DIODES(美台), dioo(帝奥微), Eaton(伊顿), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), LITEON(光宝), Littelfuse(美国力特), Lumileds(亮锐), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Murata(村田), MXIC(旺宏), Nexperia(安世), NVIDIA(英伟达), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), pSemi, Qualcomm(高通), Quectel(移远), Richtek(立锜), Samsung(三星), SEMTECH(升特), SGMICRO(圣邦), Silicon Labs(芯科), Skyworks(思佳讯), Sony(索尼), STMicroelectronics(意法半导体), TDK(东电化), TE Connectivity(泰科), Texas Instruments(德州仪器), TT Electronics, VISHAY(威世), WeEn(瑞能), YAGEO(国巨)