骏龙科技有限公司

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

ALLEGRO(美国埃戈罗), ams OSRAM(艾迈斯欧司朗), GigaDevice(兆易创新), Intel(英特尔), Micron Technology, onsemi(安森美), Renesas(瑞萨), SK Hynix(海力士), TE Connectivity(泰科), TT Electronics

3PEAK(思瑞浦), ABB, AMD(超威), AMLOGIC(晶晨), ams OSRAM(艾迈斯欧司朗), Analog Devices(亚德诺), AWINIC(艾为), CXMT(长鑫存储), FM(复旦微), GigaDevice(兆易创新), LITEON(光宝), Longsys(江波龙), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Nexperia(安世), NVIDIA(英伟达), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), Qorvo(超群), Qualcomm(高通), Quectel(移远), Renesas(瑞萨), SEMTECH(升特), SGMICRO(圣邦), Silergy(矽力杰), UNISOC(紫光展锐), WeEn(瑞能), XHSC(小华半导体), XMC(武汉新芯)

3PEAK(思瑞浦), ams OSRAM(艾迈斯欧司朗), APM(永源), Autochips(杰发科技), Cmsemicon(中微), Eaton(伊顿), FM(复旦微), GigaDevice(兆易创新), ISSI(矽成), Longsys(江波龙), MCC(美微科), MPS(芯源), MXIC(旺宏), NOVOSENSE(纳芯微电子), NXP(恩智浦), onsemi(安森美), Rockchip(瑞芯微), Silicon Labs(芯科), Tianma(天马), ZLG(致远)

Analog Devices(亚德诺), Infineon(英飞凌), Micron Technology, NVIDIA(英伟达), onsemi(安森美), Parade(谱瑞), Qorvo(超群), QUNXIN(群芯微), Renesas(瑞萨), vgsemi(威兆)