香农芯创科技股份有限公司

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

AltoBeam(高拓讯达), AOS(万国半导体), COSEMITECH(意瑞), CR MICRO(华润微), ESMT(晶豪), INJOINIC(英集芯), ISSI(矽成), ITE(联阳), Longsys(江波龙), MediaTek(联发科), Microchip(微芯), MPS(芯源), Nexperia(安世), Nordic(北欧半导体), Onmicro(昂瑞微), Quectel(移远), SCT(芯洲科技), SEMTECH(升特), SENSYLINK(申矽凌), SGMICRO(圣邦), Silergy(矽力杰), SIMCom(芯讯通), XHSC(小华半导体), XTX Technology(芯天下)

AMD(超威), MediaTek(联发科), SK Hynix(海力士)