深圳淇诺科技有限公司

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

Chipown(芯朋微), Cmsemicon(中微), ESMT(晶豪), Everest-semi(顺芯), FM(复旦微), GigaDevice(兆易创新), HISILICON(海思), Renesas(瑞萨), RUNIC(润石), Tollsemi(拓尔微), vgsemi(威兆)

3L COILS(台湾三礼), APM(永源), CHIPSEA(芯海科技), Churod(中汇瑞德), CONNTEK(昆泰芯), CR MICRO(华润微), Fenghua(风华高科), GPT(泰科天润), Hosonic(鸿星), INJOINIC(英集芯), JJW(捷捷微电), NCEPOWER(新洁能), NOVOSENSE(纳芯微电子), PanJit(强茂), Prisemi(芯导), RUNIC(润石), Senodia(深迪), Silan(士兰微), Silergy(矽力杰), Sunlord(顺络), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), Wayon(维安)