立功科技

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

APM(永源), Bourns(伯恩斯), CR MICRO(华润微), FM(复旦微), GigaDevice(兆易创新), Qorvo(超群), Qualcomm(高通), Quectel(移远), ROHM(罗姆), TDK(东电化), Tollsemi(拓尔微), Uniohm(厚声), UTC(友顺)

Allwinner(全志), AMD(超威), AMPAK(正基科技), ams OSRAM(艾迈斯欧司朗), AOS(万国半导体), FM(复旦微), GigaDevice(兆易创新), GPT(泰科天润), HISILICON(海思), Intel(英特尔), ISSI(矽成), KYOCERA AVX(京瓷), Littelfuse(美国力特), Longsys(江波龙), LOONGSON(龙芯), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Murata(村田), NVIDIA(英伟达), Oriental SEMI(东微半导体), PANASONIC(松下), Quectel(移远), QUNXIN(群芯微), Realtek(瑞昱), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), Sandisk(闪迪), SGMICRO(圣邦), Skyworks(思佳讯), Telit Cinterion, VISHAY(威世), YMTC(长江存储)