深圳市微效电子有限公司

Cmsemicon(中微), CR MICRO(华润微), Holy Stone(禾伸堂), Hosonic(鸿星), JJW(捷捷微电), Lelon(立隆), LRC(乐山无线电), Ralec(旺诠), TDK(东电化)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

BASiC(基本半导体), Chipown(芯朋微), GigaDevice(兆易创新), Hongfa(宏发), JJW(捷捷微电), Lelon(立隆), NCEPOWER(新洁能), NOVOSENSE(纳芯微电子), Oriental SEMI(东微半导体), PanJit(强茂), SGMICRO(圣邦)

Allwinner(全志), AltoBeam(高拓讯达), Amphenol(安费诺), BYD(比亚迪半导体), bynav(北云科技), CR MICRO(华润微), Everest-semi(顺芯), Flex(伟创力), GALAXYCORE(格科微), GigaDevice(兆易创新), GPT(泰科天润), HISILICON(海思), Innovision(长工微), JLSEMI(景略), Lanhai Photoelectricity(蓝海光电), LG, Littelfuse(美国力特), Longsys(江波龙), LRC(乐山无线电), Maxio(联芸科技), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), PANGOMICRO, PIP Semi(丽隽), Prisemi(芯导), pSemi, SMARTSENS(思特威), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), Techpoint, THine(赛恩电子), Tollsemi(拓尔微), Truly(信利), UNISOC(紫光展锐), vgsemi(威兆), Wolfspeed

ESMT(晶豪), FMD(辉芒微), HI CHIP(海奇半导体), HTSEMI(金誉), LANKERSEMI(兰科半导体), MXIC(旺宏), SENSYLINK(申矽凌), XMC(武汉新芯)