深圳品创兴科技有限公司

CHIPSEA(芯海科技), Hiksemi(海康存储), HORIZON(地平线), KDS(大真空), LRC(乐山无线电), Nordic(北欧半导体), NOVOSENSE(纳芯微电子), ROHM(罗姆), SEMTECH(升特), SGMICRO(圣邦), STMicroelectronics(意法半导体), UNISOC(紫光展锐)

Cmsemicon(中微), CR MICRO(华润微), Holy Stone(禾伸堂), Hosonic(鸿星), JJW(捷捷微电), Lelon(立隆), LRC(乐山无线电), Ralec(旺诠), TDK(东电化)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

ALLEGRO(美国埃戈罗), ams OSRAM(艾迈斯欧司朗), GigaDevice(兆易创新), Intel(英特尔), Micron Technology, onsemi(安森美), Renesas(瑞萨), SK Hynix(海力士), TE Connectivity(泰科), TT Electronics

3PEAK(思瑞浦), ABB, AMD(超威), AMLOGIC(晶晨), ams OSRAM(艾迈斯欧司朗), Analog Devices(亚德诺), AWINIC(艾为), CXMT(长鑫存储), FM(复旦微), GigaDevice(兆易创新), LITEON(光宝), Longsys(江波龙), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Nexperia(安世), NVIDIA(英伟达), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), Qorvo(超群), Qualcomm(高通), Quectel(移远), Renesas(瑞萨), SEMTECH(升特), SGMICRO(圣邦), Silergy(矽力杰), UNISOC(紫光展锐), WeEn(瑞能), XHSC(小华半导体), XMC(武汉新芯)