深圳市驰远电子有限公司

AGM(遨格芯微), BELLING(贝岭), CHIPSEA(芯海科技), dioo(帝奥微), Epson(爱普生), GigaDevice(兆易创新), Longsys(江波龙), Prisemi(芯导)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

Aeonsemi(益昂), ALLEGRO(美国埃戈罗), Ambarella(安霸), AMLOGIC(晶晨), Ampleon, ams OSRAM(艾迈斯欧司朗), AnDAPT, Asmedia(祥碩), Avalanche Technology, DIODES(美台), Efinix, ESMT(晶豪), GigaDevice(兆易创新), Hoturnkey(好神奇), Intel(英特尔), LG, Lumileds(亮锐), MagnaChip(美格纳), Marvell(美满), MAXLINEAR(迈凌), MediaTek(联发科), Microchip(微芯), Micron Technology, MPS(芯源), Nanya(南亚科技), Navitas Semiconductor(纳微半导体), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PanJit(强茂), Qualcomm(高通), Renesas(瑞萨), Richtek(立锜), Silergy(矽力杰), Silicon Labs(芯科), Skyworks(思佳讯), STMicroelectronics(意法半导体), Synaptics(新思国际), u-blox, VISHAY(威世), Wolfspeed

3L COILS(台湾三礼), AisinoChip(航芯), Amphenol(安费诺), BM(丰明电容), BYD(比亚迪半导体), Chipown(芯朋微), Churod(中汇瑞德), COSEMITECH(意瑞), CR MICRO(华润微), Etasolution(钰泰), Fenghua(风华高科), Holy Stone(禾伸堂), Honeywell(霍尼韦尔), Hongfa(宏发), Hosonic(鸿星), Knowles(楼氏), LITEON(光宝), Longsys(江波龙), LRC(乐山无线电), MCC(美微科), Nation(国民技术), Nexperia(安世), Onmicro(昂瑞微), PanJit(强茂), QUNXIN(群芯微), Ralec(旺诠), ROHM(罗姆), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), TDK(东电化), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), VISHAY(威世)

ESMT(晶豪), FMD(辉芒微), HI CHIP(海奇半导体), HTSEMI(金誉), LANKERSEMI(兰科半导体), MXIC(旺宏), SENSYLINK(申矽凌), XMC(武汉新芯)