深圳品创兴科技有限公司

AMPAK(正基科技), ARM, Bourns(伯恩斯), BROADCOM(博通), DIODES(美台), Epson(爱普生), ESMT(晶豪), Etron(钰创), Littelfuse(美国力特), MCC(美微科), MXIC(旺宏), Navitas Semiconductor(纳微半导体), Renesas(瑞萨), SEMTECH(升特), vgsemi(威兆)

BELLING(贝岭), Churod(中汇瑞德), Cmsemicon(中微), JJW(捷捷微电), Linearin(先积集成), LOONGSON(龙芯), NCEPOWER(新洁能), PanJit(强茂), QUNXIN(群芯微), Rockchip(瑞芯微), RUNIC(润石), SCT(芯洲科技), SGMICRO(圣邦), Sunlord(顺络), TAIYO YUDEN(太诱), Uniohm(厚声), XHSC(小华半导体)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

3PEAK(思瑞浦), Ampleon, Barrot(百瑞), BELLING(贝岭), CR MICRO(华润微), CXMT(长鑫存储), GigaDevice(兆易创新), HISILICON(海思), KDS(大真空), KIOXIA(铠侠), Knowles(楼氏), Longsys(江波龙), Lumileds(亮锐), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), onsemi(安森美), Quectel(移远), Renergy(锐能微), ROHM(罗姆), SMARTSENS(思特威), Sony(索尼), STMicroelectronics(意法半导体), VISHAY(威世), WPM(维攀微), XMC(武汉新芯)

APM(永源), Bourns(伯恩斯), CR MICRO(华润微), FM(复旦微), GigaDevice(兆易创新), Qorvo(超群), Qualcomm(高通), Quectel(移远), ROHM(罗姆), TDK(东电化), Tollsemi(拓尔微), Uniohm(厚声), UTC(友顺)