威健实业国际有限公司

CR MICRO(华润微), Eaton(伊顿), Epson(爱普生), KYOCERA AVX(京瓷), Littelfuse(美国力特), NCEPOWER(新洁能), ROHM(罗姆), Silicon Labs(芯科), TE Connectivity(泰科), TT Electronics, Uniohm(厚声)

CHIPSEA(芯海科技), Hiksemi(海康存储), HORIZON(地平线), KDS(大真空), LRC(乐山无线电), Nordic(北欧半导体), NOVOSENSE(纳芯微电子), ROHM(罗姆), SEMTECH(升特), SGMICRO(圣邦), STMicroelectronics(意法半导体), UNISOC(紫光展锐)

BELLING(贝岭), Churod(中汇瑞德), Cmsemicon(中微), JJW(捷捷微电), Linearin(先积集成), LOONGSON(龙芯), NCEPOWER(新洁能), PanJit(强茂), QUNXIN(群芯微), Rockchip(瑞芯微), RUNIC(润石), SCT(芯洲科技), SGMICRO(圣邦), Sunlord(顺络), TAIYO YUDEN(太诱), Uniohm(厚声), XHSC(小华半导体)

AOS(万国半导体), CONNTEK(昆泰芯), Fenghua(风华高科), JJW(捷捷微电), KEMET(基美), KYOCERA AVX(京瓷), Lelon(立隆), Linearin(先积集成), LRC(乐山无线电), Nexperia(安世), PANASONIC(松下), PanJit(强茂), Ralec(旺诠), ROHM(罗姆), Seeed(矽递科技), TAIYO YUDEN(太诱), TDK(东电化), TE Connectivity(泰科), TOREX(特瑞仕), YAGEO(国巨)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)