益登科技股份有限公司

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)

Allwinner(全志), AltoBeam(高拓讯达), Amphenol(安费诺), BYD(比亚迪半导体), bynav(北云科技), CR MICRO(华润微), Everest-semi(顺芯), Flex(伟创力), GALAXYCORE(格科微), GigaDevice(兆易创新), GPT(泰科天润), HISILICON(海思), Innovision(长工微), JLSEMI(景略), Lanhai Photoelectricity(蓝海光电), LG, Littelfuse(美国力特), Longsys(江波龙), LRC(乐山无线电), Maxio(联芸科技), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), PANGOMICRO, PIP Semi(丽隽), Prisemi(芯导), pSemi, SMARTSENS(思特威), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), Techpoint, THine(赛恩电子), Tollsemi(拓尔微), Truly(信利), UNISOC(紫光展锐), vgsemi(威兆), Wolfspeed

3L COILS(台湾三礼), AisinoChip(航芯), Amphenol(安费诺), BM(丰明电容), BYD(比亚迪半导体), Chipown(芯朋微), Churod(中汇瑞德), COSEMITECH(意瑞), CR MICRO(华润微), Etasolution(钰泰), Fenghua(风华高科), Holy Stone(禾伸堂), Honeywell(霍尼韦尔), Hongfa(宏发), Hosonic(鸿星), Knowles(楼氏), LITEON(光宝), Longsys(江波龙), LRC(乐山无线电), MCC(美微科), Nation(国民技术), Nexperia(安世), Onmicro(昂瑞微), PanJit(强茂), QUNXIN(群芯微), Ralec(旺诠), ROHM(罗姆), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), TDK(东电化), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), VISHAY(威世)

3L COILS(台湾三礼), APM(永源), CHIPSEA(芯海科技), Churod(中汇瑞德), CONNTEK(昆泰芯), CR MICRO(华润微), Fenghua(风华高科), GPT(泰科天润), Hosonic(鸿星), INJOINIC(英集芯), JJW(捷捷微电), NCEPOWER(新洁能), NOVOSENSE(纳芯微电子), PanJit(强茂), Prisemi(芯导), RUNIC(润石), Senodia(深迪), Silan(士兰微), Silergy(矽力杰), Sunlord(顺络), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), Wayon(维安)

Advanced Analog Technology, AKM, Alif Semiconductor, AMPAK(正基科技), Ampere, Analogix(硅谷数模), AppoTech(卓荣), ArkX, AsteraLabs, Axelite(亚瑟莱特), Baraja, C-media, Canyon(耕源), Cimetrix, Cyberlink, Eggtronic, EGIS, FocalTech, FRAMOS, FURUNO(古野), GigaDevice(兆易创新), GoMore, Hannstar(瀚宇彩晶), INJOINIC(英集芯), Innolux(群创光电), ITE(联阳), Kinetic(芯凯), Kingston(金士顿), Leahkinn(力勤), LG, Longsys(江波龙), Marvell(美满), Maxscend, Micron Technology, MinebeaMitsumi, MPS(芯源), NVIDIA(英伟达), Pixelworks, Qorvo(超群), Renesas(瑞萨), RICOM(福光), ROHM(罗姆), Sandisk(闪迪), Silanna, Silicon Labs(芯科), Sinopower(大中), Skyworks(思佳讯), Solomon(晶门), Sonion, Sony(索尼), STMicroelectronics(意法半导体), Superior Sensor Technology, Supermicro(超微), Synaptics(新思国际), TagoreTech, TAIYO YUDEN(太诱), Taoglas, TDK(东电化), Telit Cinterion, Terminus(汤铭), THALES(泰雷兹), TOREX, Union(英联), USI(环旭), Western Digital(西部数据), Zowie(智威科技)