艾睿电子（Arrow Electronics）

3L COILS(台湾三礼), COSEMITECH(意瑞), Lelon(立隆), Littelfuse(美国力特), PanJit(强茂), PSA(华新科), TDK(东电化)

3PEAK(思瑞浦), Ampleon, Barrot(百瑞), BELLING(贝岭), CR MICRO(华润微), CXMT(长鑫存储), GigaDevice(兆易创新), HISILICON(海思), KDS(大真空), KIOXIA(铠侠), Knowles(楼氏), Longsys(江波龙), Lumileds(亮锐), Murata(村田), OMRON(欧姆龙), Onmicro(昂瑞微), onsemi(安森美), Quectel(移远), Renergy(锐能微), ROHM(罗姆), SMARTSENS(思特威), Sony(索尼), STMicroelectronics(意法半导体), VISHAY(威世), WPM(维攀微), XMC(武汉新芯)

3L COILS(台湾三礼), AisinoChip(航芯), Amphenol(安费诺), BM(丰明电容), BYD(比亚迪半导体), Chipown(芯朋微), Churod(中汇瑞德), COSEMITECH(意瑞), CR MICRO(华润微), Etasolution(钰泰), Fenghua(风华高科), Holy Stone(禾伸堂), Honeywell(霍尼韦尔), Hongfa(宏发), Hosonic(鸿星), Knowles(楼氏), LITEON(光宝), Longsys(江波龙), LRC(乐山无线电), MCC(美微科), Nation(国民技术), Nexperia(安世), Onmicro(昂瑞微), PanJit(强茂), QUNXIN(群芯微), Ralec(旺诠), ROHM(罗姆), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), TDK(东电化), TE Connectivity(泰科), Uniohm(厚声), UTC(友顺), VISHAY(威世)

3PEAK(思瑞浦), Ampleon, Barrot(百瑞), Chiplntelli(启英泰伦), CXMT(长鑫存储), GigaDevice(兆易创新), HISILICON(海思), KIOXIA(铠侠), Knowles(楼氏), LITEON(光宝), Murata(村田), Onmicro(昂瑞微), onsemi(安森美), Quectel(移远), Renergy(锐能微), Sanrise Tech(尚阳通), SCT(芯洲科技), SMARTSENS(思特威), Syntiant, VISHAY(威世), WPM(维攀微), Yantel(研通)

3PEAK(思瑞浦), ABB, Advantech(研华), ALLEGRO(美国埃戈罗), AMD(超威), Ampleon, ams OSRAM(艾迈斯欧司朗), Analog Devices(亚德诺), Bourns(伯恩斯), CHIPSEA(芯海科技), DIODES(美台), dioo(帝奥微), Eaton(伊顿), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), LITEON(光宝), Littelfuse(美国力特), Lumileds(亮锐), MAXLINEAR(迈凌), Microchip(微芯), Micron Technology, Molex(莫仕), Murata(村田), MXIC(旺宏), Nexperia(安世), NVIDIA(英伟达), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), pSemi, Qualcomm(高通), Quectel(移远), Richtek(立锜), Samsung(三星), SEMTECH(升特), SGMICRO(圣邦), Silicon Labs(芯科), Skyworks(思佳讯), Sony(索尼), STMicroelectronics(意法半导体), TDK(东电化), TE Connectivity(泰科), Texas Instruments, TT Electronics, VISHAY(威世), WeEn(瑞能), YAGEO(国巨)