文晔科技股份有限公司

Amphenol(安费诺), Laird(莱尔德), Molex(莫仕), TE Connectivity(泰科)

3L COILS(台湾三礼), COSEMITECH(意瑞), Lelon(立隆), Littelfuse(美国力特), PanJit(强茂), PSA(华新科), TDK(东电化)

BELLING(贝岭), Churod(中汇瑞德), Cmsemicon(中微), JJW(捷捷微电), Linearin(先积集成), LOONGSON(龙芯), NCEPOWER(新洁能), PanJit(强茂), QUNXIN(群芯微), Rockchip(瑞芯微), RUNIC(润石), SCT(芯洲科技), SGMICRO(圣邦), Sunlord(顺络), TAIYO YUDEN(太诱), Uniohm(厚声), XHSC(小华半导体)

3L COILS(台湾三礼), AWINIC(艾为), BB Electronics, Capxon(丰宾), GigaDevice(兆易创新), Hosonic(鸿星), KEMET(基美), KYOCERA AVX(京瓷), Lelon(立隆), Littelfuse(美国力特), MICRO CRYSTAL, Molex(莫仕), Nichicon(尼吉康), PSA(华新科), Qualcomm(高通), Samsung(三星), Silergy(矽力杰), Sunlord(顺络), TDK(东电化), TE Connectivity(泰科), TXC Corporation(台湾晶技), VISHAY(威世), YAGEO(国巨)

AMD(超威), Amphenol(安费诺), ams OSRAM(艾迈斯欧司朗), AWINIC(艾为), BROADCOM(博通), CR MICRO(华润微), DIODES(美台), ESMT(晶豪), FM(复旦微), HISILICON(海思), Infineon(英飞凌), Intel(英特尔), ISSI(矽成), KEMET(基美), KIOXIA(铠侠), Laird(莱尔德), LITEON(光宝), Littelfuse(美国力特), LRC(乐山无线电), MAXLINEAR(迈凌), MCC(美微科), MediaTek(联发科), Microchip(微芯), Micron Technology, Molex(莫仕), MPS(芯源), Murata(村田), Nanya(南亚科技), NCEPOWER(新洁能), Nexperia(安世), NOVOSENSE(纳芯微电子), Nuvoton(新唐), NXP(恩智浦), Omnivision(豪威科技), onsemi(安森美), PANASONIC(松下), PanJit(强茂), Parade(谱瑞), pSemi, Qualcomm(高通), Rockchip(瑞芯微), RUNIC(润石), Samsung(三星), SGMICRO(圣邦), Silergy(矽力杰), SK Hynix(海力士), Skyworks(思佳讯), STMicroelectronics(意法半导体), TAIYO YUDEN(太诱), TT Electronics, VISHAY(威世), WeEn(瑞能), Winbond(华邦)